» Bambu Lab PVA Support filament 500g

Bambu Lab PVA Support filament 500g

Name: Bambu Lab PVA Support filament 500g
Brand: Bambu Lab
SKU: 6907
Price: 46.00 EUR
Availability: InStock

46.00€ Incl Tax

Product available

Water-soluble
Recommended for PLA and PETG
Compatbile AMS
1.75 mm / 500g

Quantity :

Add to cart

Request a quotation

description

Technical Specifications

Contents of order

Documentation

Notice

Bambu Lab PVA Support Filament

Bambu PVA is a water-soluble support material. It offers effective support for complex designs and overhangs, and can be easily dissolved in water once printing is complete. Compatible with different types of filament, it facilitates post-processing and reduces the risk of damaging the printed object when removing the support.

Dissolve to reveal your creations

Bambu PVA has the ability to dissolve in water, reaching down to the finest detail to offer support where conventional substrates fall short. Thanks to Bambu PVA, you can create and print models that were previously considered impossible.

Clean, deformation-free support surface

This water-soluble backing material can adjust to zero interface spacing, ensuring perfect adhesion to the print surface. This results in precise, smooth contact surfaces for your prints.

Clean and complete dissolution

Bambu PVA is formulated with high-quality components that dissolve quickly and completely in water, allowing effortless removal of backing material and eliminating the need for manual cleaning.

HEX code table

Support filaments comparision

	PVA	Support pour PLA	Support for PA/PET
Compatibility	PLA, PETG, PLA-CF/GF, PETG-CF/GF	PLA, PLA-CF/GF	PA, PA-CF/GF, PA6-CF/GF PAHT-CF/GF, PET-CF/GF
Nozzle Compatilibity	All Size / Material		0.2 mm Nozzle Not Compatible
Solubility	Water-dissolvable	Water-insoluble

Accessory Compatibility

	Recommanded	Not Recommanded
Build Plate	Cool Plate, High Temperature Plate or Textured PEI Plate	Engineering Plate
Hotend	All Size / Material	/
Glue	Bambu Liquid Glue / Glue Stick	/

RFID for intelligent printing

All print parameters are integrated into the RFID, which can be read via our AMS (Automatic Material System).

Load and print! No more tedious setup steps.

description

Technical Specifications

Contents of order

Documentation

Notice

Density	1.27 g/cm³
Nozzle temperature	220 - 250 °C
Build plate Type	Cool Plate, High Temperature Plate or Textured PEI Plate
Bed Surface Preparation	Glue
Bed temperature (with PVP adhesive)	35 - 45 °C
Print speed	< 200 mm/s
Drying parameters before printing	80 °C, 8 - 12 hours
Printing and maintaining container humidity	< 20% RH (sealed, with desiccant)
Cooling fan	Turn on
Retraction Lenght	0.6 - 1.0 mm
Retraction Speed	20 - 40 mm/s
Max Overhang Angle	55°
Max Bridging Length	30 mm
Support Material	Support for PLA
Melting temperature	202°C
Melting index	7.2 +/- 1.1 g/10 min
Tensile strength (X-Y)	N / A