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Raise3D E3 3D Printer

Name: Raise3D E3 3D Printer
Brand: Raise3D
SKU: 8138
Price: 2398.80 EUR
Availability: InStock

2398.80€ Incl Tax

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Technical Specification

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Raise3D E3

The Professional IDEX 3D Printer for Flexible, Engineering-Grade, and Expandable Manufacturing

The Raise3D E3 represents a strategic evolution in professional additive manufacturing, succeeding the established E2 and E2CF lineages. Launched as a unified high-performance platform, the E3 is built on three core pillars: Elastic, Engineering-grade, and Expandable. This Independent Dual Extrusion (IDEX) system is engineered to bridge the gap between functional prototyping and small-batch industrial production, offering unprecedented versatility for complex geometries and advanced material applications.

IDEX Technology: Maximizing Throughput and Versatility

At the heart of the E3 is the Independent Dual Extrusion (IDEX) architecture. Unlike conventional dual-extrusion systems, the E3’s print heads move independently along the X-axis, eliminating cross-contamination and allowing for specialized high-productivity modes:

Duplication Mode: Simultaneous printing of two identical parts, doubling production capacity.

Mirror Mode: Real-time production of a model and its symmetrical inverse, ideal for automotive and medical applications.

Multi-Material Integration: Seamlessly combine rigid structures with soluble supports or overmold soft elastomers onto engineering-grade plastics.

Mastery of Flexible and Composite Materials

The E3 redefines what's possible with challenging materials, bringing industrial-grade reliability to flexible and composite printing.

High-Speed TPU Printing (with Auxiliary Feeder)

Flexible filaments like TPU have traditionally been slow and unreliable to print. The E3 changes this through its compatibility with the optional Raise3D Flexible Filament Auxiliary Feeder. This dedicated buffer system stabilizes the feed path, preventing buckling and allowing for consistent, high-quality printing of elastic materials at speeds up to 200 mm/s. It expands compatibility across a wide range of Shore hardness, from the firm TPU-95A down to softer TPU-80A, TPE-S, and TPE foam, opening new possibilities for the footwear and medical industries.

Engineered for Composites

Succeeding the E2CF, the E3 is built to handle abrasive, reinforced filaments. When equipped with the optional composite filament print head (featuring hardened nozzles like silicon carbide), the E3 reliably processes engineering-grade materials such as PET CF, PET GF, PPS CF, and PA12 CF+ . This allows you to produce parts with exceptional strength-to-weight ratios and chemical resistance, suitable for demanding applications in aerospace and chemical processing.

Achieving Injection-Molding Surface Finish

A major challenge in FFF printing has been the aesthetic and functional quality of top surfaces. The Raise3D E3 introduces Pro Ironing, a synergistic feature combining precise Z-axis control, advanced ideaMaker slicing profiles, and specialized filaments like Hyper Speed PLA Pro or Industrial PETG ESD. This process performs a secondary pass over the top layer, reflowing the material to achieve an exceptionally smooth surface with an average roughness (Ra < 2 µm). This finish is comparable to injection molding, allowing for the direct production of high-fidelity cosmetic prototypes and end-use parts without extensive post-processing.

Precision, Reliability, and User-Friendly Operation

The E3 is designed for consistent, high-quality results with minimal intervention.

		Automated 9-Point Bed Leveling: A sensor maps the build plate's topography and compensates for surface variations in real-time, ensuring a perfect first layer and superior adhesion across the entire 330 mm print width. Substrate Printing: The precision of the leveling system enables printing directly onto flat, pre-existing objects like phone cases or electronic enclosures, unlocking unique creative and functional applications.

Uninterrupted Printing: Two integrated material storage slots with desiccant keep filaments dry, preventing moisture-related defects. Filament run-out sensors and power loss recovery ensure long, complex prints can be completed reliably, even in the event of material depletion or a power outage. Environmental Control: A fully enclosed chamber with a HEPA filter and activated charcoal maintains a stable thermal environment and filters ultrafine particles and odors, making it safe for indoor professional spaces.

Smart Connectivity: Monitor and manage your prints remotely via the integrated live camera, Wi-Fi, and Ethernet, all accessible through the intuitive 7-inch touchscreen and the RaiseCloud platform.

Software Ecosystem

ideaMaker (free, Windows/macOS/Linux) handles STL, OBJ, 3MF, STEP and IGES files and generates G-code. Advanced functions include Pro Ironing, interlocking for dual-material parts, and substrate-printing offsets.

Discover the Raise3D E3 in video !

The Raise3D E3 combines high-speed flexible printing, composite capability and professional reliability in a single expandable platform — the ideal solution for engineering teams and production environments requiring consistent results across diverse materials.

description

Technical Specification

Contents of order

Documentation

Notice

Technical Specifications

Dimensions physiques Raise3D E3
Machine Dimensions	614 × 597 × 487 mm
Net Weight	33.3 kg (73.4 lbs)
Gross Weight (Carton Only)	42 kg (92.6 lbs)
Gross Weight (Carton with Pallet)	49.5 kg (109.1 lbs)
Printing
Technology	FFF - Fused Filament Fabrication
Build Volume	Single Extruder Print: 330 × 240 × 240 mm (13 × 9.4 × 9.4 inch) Dual Extruder Print: 295 × 240 × 240 mm (11.6 × 9.4 × 9.4 inch)
Print Head System	IDEX Independent Dual Extruders
Max Printing Speed	200 mm/s
Vitesse volumétrique maximale	16 mm³/s
Filament Diameter	1.75 mm
Nozzle Diameter	0.4 mm (Default), 0.2/ 0.6/ 0.8/ 1.0 mm (Available)
Build Plate	Flexible Double-sided PEI Build Plate (Default), Flexible Steel Plate with BuildTak (Available)
Build Plate Leveling	Mesh-leveling with Flatness Detection
Heated Bed Material	Silicone
Max Build Plate Temperature	110ºC
Température maximale de la buse	330ºC
Layer Height	The E3 is compatible with 0.2, 0.4, 0.6, 0.8 and 1.0 mm nozzles, and the layer height can vary between 0.1-0.5 mm. To achieve stable print results, when using 0.4 mm nozzles, we recommend using a layer height between 0.1-0.3 mm.
Surface Roughness Ra	< 2 μm (Hyper Speed PLA Pro Filament, Ironing enabled)
Filament Run-out Sensor	Available
Filter	HEPA Filter with Activated Charcoal
Connectivity	Wi-Fi, LAN, USB port, Live Camera
Power Supply Input	100-240 V AC, 50/ 60 Hz 230 V @ 2 A
Power Supply Output	24 V DC, 350 W
SOFTWARE
Slicing Software	ideaMaker
Supported File Types	STL/ OBJ/ 3MF/ OLTP/ STEP/ STP/ IGES/ IGS
Supported OS	Windows/ macOS/ Linux
Machine Code Type	GCODE
PRINTER CONTROLLER
User Interface	7-inch Touch Screen
Power Loss Recovery	Available
Screen Resolution	1024 × 600
Motion Controller	Atmel ARM Cortex-M4 120MHz FPU
Logic Controller	NXP ARM Cortex-A55 Quad 2 GHz
Memory	2 GB
Réseau	Wi-Fi, Ethernet
Onboard Flash	16 GB
Operating System	Embedded Linux
Ports	USB 2.0 × 2, Ethernet × 1
MATERIAL
Material Type	Hyper Core: PPA CF/ PPA GF/ ABS CF Hyper Speed: PLA/ ABS/ PETG CF/ PET CF/ PLA Pro Industrial: PPA CF/ PPA GF/ PET CF/ PET GF/ PETG ESD/ PET Support/ PPA Support/ PPS CF/ PA12 CF+ Premium: PLA/ ABS/ ASA/ PETG/ PC/ TPU-95A/ PVA+
Flexible and Elastic Material	When equipped with the Flexible Filament Auxiliary Feeder, the E3 is compatible with TPE (TPU, TPE-A, TPE-S, TPE foam filaments, etc.), Shore (A) hardness between 95A and 80A (e.g. TPU-95A, 90A, 80A), as well as all Shore (D) hardness filaments.
Third Party Material	Supported by Raise3D OMP (Open Material Program) Note: For detailed information and slicing profiles of the materials supported by Raise3D OFP, please visit https://www.ideamaker.io/.