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Bambu Lab X1 series / P1P Bambu Cool Plate (Normal Temperature)

Bambu Lab X1 series / P1P Bambu Cool Plate (Normal Temperature)
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Bambu Lab X1 series / P1P Bambu Cool Plate (Normal Temperature)
Bambu Lab X1 series / P1P Bambu Cool Plate (Normal Temperature)

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Bambu Cool Plate (Normal Temperature) - Bambu Lab X1 series / P1P

 

 

Bambu Lab's high temperature print bed is perfect for printing PLA or low glass transition temperature filaments. During printing, the tray will provide excellent adhesion and easy removal of the 3D printed object after cooling.

 

 

Benefits

Downsides

  • Works best with low glass transition temperature filaments as it can be used at a low temperature for the hotbed

  • Works well with the Automatic Calibration for flow rate and does not interfere with the LIDAR

  • Smooth texture on the surface of the print

  • Excellent adhesion and easy print removal

  • Can be replaced by the user

  • Cannot be used without glue stick as the surface can be easily damaged if glue stick is not used

  • It is not recommended for high-temperature materials as bubbles can form underneath the print surface and cause damage

  • Can be more fragile compared to the Engineering Plate or Textured PEI Plate

 

 

 

 

 

 

 

 

 

Recommendation

 

  • Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.

 

  • Bambu Lab recommends only using Bambu Lab official glue on the Cool Plate, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates.

 

 

 

 

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Surface temperature resistance

Up to 120 °C

Usable print size

256 x 256 mm

High-temp Plate sticker thickness

0.4 mm

Flexible spring steel thickness

0.5 mm

Package Weight

320 g

Package size

290 x 290 x 4 mm

 

 

 

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Cool Plate

 

 

 Hotend temperature

Glue Stick Required?

PLA/PLA-CF/PLA-GF

35 - 45 °CYes

TPU

30 - 35 °CYes
PVA35 - 45 °CYes

 

 

 

 

Engineering Plate (normal plate)

 

 

 Hotend Temperature

Glue Stick Required ?

Upper Glass Cover Plate Removed ?

ABS

100 - 110 °CYesNo
PETG70 - 80 °CRecommendedYes

TPU

30 - 35 °C

Recommended

No

PC/PC-CF

100 - 110 °CYesNo

PA/PA-CF/PAHT-CF

100 - 110 °CYesNo

 

 

 

 

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  • 3 Front Housing Assembly

 

 

 

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Customer reviews
Number's review: 2
Product rating: 4.5/5 note
Trusted certificate
Customer reviews 09/04/2024
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Produit conforme à mes attentes
Customer reviews 16/03/2024
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j'avais deja ,donc pas de surprise
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