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Bambu Lab X1 series / P1P Bambu High Temperature Plate

Bambu Lab X1 series / P1P Bambu High Temperature Plate
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Bambu Lab X1 series / P1P Bambu High Temperature Plate
Bambu Lab X1 series / P1P Bambu High Temperature Plate

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Bambu High Temperature Plate - Bambu Lab X1 series / P1P

 

 

Bambu Lab's high temperature print bed is ideal for printing materials like PETG, ABS and ASA. During printing, the tray will provide excellent adhesion and easy removal of the 3D printed object after cooling.

 

 

Benefits

Downsides

  • Works best with most 3D printing filaments

  • Works well with the Automatic Calibration for

  • Flow rate and does not interfere with the LIDAR

  • Smooth texture on the surface of the print

  • Excellent adhesion and easy print removal

  • Can be replaced by the user

  • It cannot be used without heating the printing surface

  • Can be more fragile compared to the EngineeringPlate or Textured PEI Plate

  • The upper glass cover plate, or the front glass door need to be opened for filaments with a low glass transition temperature

 

 

 

 

 

 

 

 

 

Recommendation

 

  • Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.

 

  • Bambu Lab recommends only using Bambu Lab official glue on the Cool Plate, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates.

 

 

 

 

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Surface temperature resistance

Up to 200 °C

Usable print size

256 x 256 mm

High-temp Plate sticker thickness

0.3 mm

Flexible spring steel thickness

0.5 mm

Package Weight

320 g

Package size

290 x 290 x 4 mm

 

 

 

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High-Temperature Plate

 

 

 Hotend temperature

Glue stick required ?

Upper Glass Cover Plate Removed ?

PLA/PLA-CF/PLA-GF

45 - 60 °CNonOui

ABS

90 - 100 °CNonNon
PETG60 - 80 °CNonNon

TPU

35 - 45 °COuiOui
ASA90 - 100 °CNonNon
PVA45 - 60 °CNonOui

PC/PC-CF

90 - 110 °COuiNon

PA/PA-CF/PAHT-CF

90 - 110 °COuiNon

 

 

 

 

Engineering Plate (normal plate)

 

 

 Hotend Temperature

Glue Stick Required ?

Upper Glass Cover Plate Removed ?

ABS

100 - 110 °CYesNo
PETG70 - 80 °CRecommendedYes

TPU

30 - 35 °C

Recommended

No

PC/PC-CF

100 - 110 °CYesNo

PA/PA-CF/PAHT-CF

100 - 110 °CYesNo

 

 

 

 

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  • 1 Bambu High Temperature Plate

 

 

 

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Product rating: 5/5 note
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Customer reviews 24/11/2023
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